Forming resin substrates using dye sublimation and substrates formed using the same

ABSTRACT

Implementations of the present invention relate generally to methods, systems, and apparatus for manufacturing aesthetically pleasing, resin-based sheets including color and/or multi-decorated images. In particular, at least one implementation includes subjecting at least one surface of a polymer sheet to uniform heat and pressure in order to sublimate a dye into the surface, and ensure that that polymer sheet is not warped or otherwise damaged during processing. Additional implementations include decorative architectural resin panels including a resin sheet having a dye sublimated into one or more surfaces in order to create an effect of depth or other aesthetic.

THE FIELD OF THE INVENTION

This present invention relates generally to decorative resin panels andprocesses, for use in decorative and/or structural architecturalapplications.

BACKGROUND AND RELEVANT ART

Recent trends in building design involve using one or more sets ofdecorative panels to add to the functional and/or aestheticcharacteristics of a given structure or design space. These recenttrends are due, at least in part, because there is sometimes moreflexibility with how the given panel (or set of panels) is designed,compared with the original structure. For example, recent panelmaterials include synthetic, polymeric resin materials, which can formedas panels to be used as partitions, walls, barriers, treatments, door,etc. Examples of such resin materials include polyvinyl chloride or“PVC”; polyacrylate materials such as poly (methyl methacrylate) or“PMMA”; polyester materials such as poly (ethylene-co-cyclohexane1,4-dimethanol terephthalate), or “PET”; poly (ethylene-co-cyclohexane1,4-dimethanol terephthalate glycol) or “PETG”; glycol modifiedpolycyclohexylenedimethlene terephthalate; or “PCTG”; as well aspolycarbonate (or PC) materials.

In general, resin materials such as these are now popular compared withdecorative cast or laminated glass materials, since resin materials maybe manufactured to be more resilient and to have a similar transparent,translucent, or decorated appearance as cast or laminated glass, butwith less cost. Decorative resins can also provide more flexibilitycompared with glass at least in terms of color, degree of texture,gauge, impact resistance, and ease of fabrication. One conventionalmethod of coloring a resin panel includes adding colorants as the resinpanel is extruded. Other techniques include the use of dye sublimation.

For example, dye sublimation involves first imparting an image ordecorative design on a dyestuff (i.e., dye carrier) with sublimationinks. The image or decorative design is typically imparted on thedyestuff by an inkjet or a laser printer. After the image is imparted onthe dyestuff, a manufacturer places the dyestuff on the substrate(object on which the image is to be printed). There are a number ofdifferent ways that the manufacturer can then sublimate the dye into thegiven substrate.

In one conventional example, the manufacturer places the assembly intoan oven, and heats the assembly above the sublimation temperature of thedye and the glass transition temperature (“T_(g)”) of the substrate. Inthis case, the manufacturer positions the assembly so that the oven'sheat source provides heat directly to the side of the substrate to bedecorated (i.e., via dye sublimation). In most if not all cases, themanufacturer also applies continuous pressure. Once the dye reaches itssublimation temperature, and the substrate has reached its T_(g), thedye infuses into the substrate, thus importing the intended image to thesubstrate. Thereafter, the manufacturer cools the assembly to atemperature below the T_(g) of the substrate.

In another conventional process, the manufacturer uses an act involvingvacuum bags or the like to aid in the distribution of pressure. Forexample, the manufacturer may place the dyestuff and substrate assemblyinto a vacuum bag. Similarly, a manufacturer can position a substrateand dyestuff within a pliable covering membrane that has dimensionsgreater than the substrate. In both cases, the manufacturer can thenevacuate the air from the assembly. In the membrane example, themanufacturer evacuates air from the covering membrane through aperforated platen placed below the substrate. After removing pressure inthis manner, the manufacturer then positions the vacuum bag assembly inan oven so that the oven's heat source applies heat primarily to theside of the assembly containing the dyestuff/dye carrier.

Unfortunately, each of the above-described conventional sublimationprocesses result in warping of the substrate to greater or lesserextents, even though prevention of warping is sometimes identified as anobjective. One reason for this is that conventional methods andapparatus only or primarily heat one side of a given assembly at atime—the side on which sublimation is intended. Specifically, heatingthe substrate primarily or exclusively on one surface/side of asubstrate can cause a non-uniform temperature gradient across thethickness or gauge of the substrate. Moreover, the effect of the uneventemperature gradient can be exacerbated when the manufacturer attemptsto further sublimate dye into a second (e.g., opposing) side of theresin substrate. That is, when the manufacturer turns the resinsubstrate over to sublimate dye on another side of the resin substrate,the resin substrate will be subjected to an uneven temperature gradientfor a second time. The renewed uneven temperature gradient on theadditional, opposing side can further warp the overall panel as before,and still further distort the already-sublimated dye image on both theoriginal side as well as on the new image side.

With relatively small and inexpensive plastic-based applications, suchas photographic papers or films, thin plastic sheets, toys, or appliancecomponents, the uneven temperature gradient in the substrate is not muchof a concern, and the effects of the temperature gradient may not be toonoticeable. This uneven temperature gradient, however, can be moreproblematic with higher-end, engineered thermoplastic substrates, thatare much larger (e.g., 4′ wide×8′ long) and thicker (e.g., ¼″, ½″, and1″ gauge), such as those used as decorative architectural resin panelsprepared with specific structural and aesthetic ends in mind for use inhigh-end building applications. Specifically, the resultant uneventemperature gradient experienced in sublimation printing of thesehigher-end substrates can cause disproportionate surface stresses in theresin panel, which ultimately can cause the resin panel to bow, warp, orcurve. This particular warping from uneven heat can render the substrateunsuitable for its shape alone, especially when installed in a framelessapplication, not to mention unsuitability due to distortion of the imagebeing sublimated.

In addition, the pressure created by the vacuum bag, or coveringmembrane on a platen, when combined with the heat needed to cause dyesublimation, tends to further deform the substrate by rounding the edgesand corners of the substrate. Specifically, conventional vacuum-basedmethods tend to result in pinching and subsequent rounding of the edgesof the plastic substrate to conform to the contours of the vacuum bag orcovering membrane. One will thus appreciate that there are thusmultiple, significant disadvantages with applying conventional dyesublimation processes to substrates where flatness, surface uniformity,and optical properties such as image crispness and alignment are at apremium for at least these reasons.

In addition to these disadvantages, conventional methods can furtherrequire long processing times that may make such methods expensive oreven commercially unviable for large architectural panels. For example,conventional methods typically involve heating and cooling the substratewithin the same processing unit in order to keep the substrate undercontinuous pressure. Thus, a manufacturer usually needs to afford timeto cool the processing unit, and then heat the processing unit up againin anticipation of processing the next substrate. Although conventionalprocessing times for heating and cooling the same processing unit may beappropriate for smaller, thinner items, where many such items can beplaced in the same unit, or where large-scale manufacturing is not aconcern, such processing times would be inefficient and prohibitivelycostly for use with substrates that are much larger (e.g., 4′ wide×8′long), and thicker (e.g., ¼″-1″ thicknesses), particularly wherelarge-scale manufacturing is desired.

Accordingly, there are a number of disadvantages in conventional methodsfor dye sublimation printing on resin substrates that can be addressed.

BRIEF SUMMARY OF THE INVENTION

Implementations of the present invention overcome one or more problemsin the art with systems, methods, and apparatus for decoratingresin-based substrates that can be used in high-end, decorativearchitectural applications. For example, implementations of the presentinvention can be used to efficiently color or decorate relatively large,resin-based substrates used in high-end, decorative architecturalapplications with dye sublimation techniques. In particular,implementations of the present invention can be used to createdye-sublimated panels, even with one or more differentiallydye-sublimated sides/surfaces, albeit without the typically expectedwarping/distortion or edge-rounding to the panel or sublimated images.Implementations of the present invention further provide for thecreation of such dye-sublimated panels using efficient andcost-effective, large-scale manufacturing techniques.

For example, a process of decorating a polymer substrate by employingdye sublimation techniques in accordance with at least oneimplementation of the present invention includes positioning at leastone sublimation dye carrier about a polymer substrate that has opposingfirst and second surfaces. The process further includes applying equalheat and pressure uniformly and simultaneously to both the first andsecond opposing surfaces of the substrate, until a dye sublimates intoand covers at least the entire first surface of the substrate.Furthermore, the resin substrate remains substantially rigid and hassurface uniformity at all edges and corners.

In addition, a process of decorating a resin substrate in accordancewith another implementation of the present invention involves placing afirst sublimation dye layer against a first surface of a substrate andplacing a second sublimation dye layer against an opposing secondsurface of the substrate. Heat and pressure is then uniformly andsimultaneously applied to both the first and second opposing surfaces ofthe substrate until the first and second dye layers sublimate a depthinto and cover the entire first and second opposing surfaces of thesubstrate. Finally, the first and second opposing surfaces of thesubstrate are cooled at the same rate.

Furthermore, a decorative architectural resin panel includes a resinsheet having a thickness defined by a distance that is perpendicular tofirst and second opposing surfaces. The panel also includes a firstsublimated dye that covers the entire first surface, and extends by afirst sublimation depth only partly into the thickness of the resinsheet. Similarly, the panel includes a second sublimated dye that coversthe entire second major surface, and extends by a second sublimationdepth only partly into the thickness of the resin sheet. The first andsecond sublimation depths are separated by a portion of the thickness ofthe resin sheet containing no sublimated dye.

Additional features and advantages of exemplary implementations of theinvention will be set forth in the description which follows, and inpart will be obvious from the description, or may be learned by thepractice of such exemplary implementations. The features and advantagesof such implementations may be realized and obtained by means of theinstruments and combinations particularly pointed out in the appendedclaims. These and other features will become more fully apparent fromthe following description and appended claims, or may be learned by thepractice of such exemplary implementations as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to describe the manner in which the above-recited and otheradvantages and features of the invention can be obtained, a moreparticular description of the invention briefly described above will berendered by reference to specific embodiments thereof which areillustrated in the appended drawings. Understanding that these drawingsdepict only typical embodiments of the invention and are not thereforeto be considered to be limiting of its scope, the invention will bedescribed and explained with additional specificity and detail throughthe use of the accompanying drawings in which:

FIG. 1A illustrates a plan view of a sulfate of a decorativearchitectural resin panel that has been decorated by means of dyesublimation in accordance with an implementation of the presentinvention;

FIG. 1B illustrates an end view of the panel of FIG. 1A;

FIG. 2A illustrates a cross-sectional view of a dye-sublimation sheetassembly for use in accordance with an implementation of the presentinvention;

FIG. 2B illustrates an exploded perspective-view of the dye-sublimationsheet assembly of FIG. 2A in accordance with an implementation of thepresent invention;

FIG. 3A illustrates a cross-sectional view of a multi-layereddye-sublimation sheet assembly in accordance with an implementation ofthe present invention;

FIG. 3B illustrates an exploded perspective-view of the multi-layereddye-sublimation sheet assembly of FIG. 3A in accordance with animplementation of the present invention;

FIG. 4 illustrates a schematic view of a system including two pressesarranged in series that can be used to process dye-sublimation sheetassemblies in accordance with an implementation of the presentinvention;

FIGS. 5A-D illustrate a sequence of physical changes in adye-sublimation sheet assembly when the dye-sublimation sheet assemblyundergoes temperature and pressure applications in accordance animplementation of the present invention;

FIG. 6 illustrates a schematic view of a system for continuous feeddye-sublimation in accordance with an implementation of the presentinvention;

FIG. 7 illustrates a schematic view of a system for imparting a dyesublimated image on a resin-based substrate with an autoclave inaccordance with an implementation of the present invention; and

FIG. 8 illustrates a chart of acts and steps in a method of decorating aresin substrate by employing dye sublimation techniques in accordancewith an implementation of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Implementations of the present invention overcome one or more problemsin the art with systems, methods, and apparatus for decoratingresin-based substrates that can be used in high-end, decorativearchitectural applications. For example, implementations of the presentinvention can be used to efficiently color or decorate relatively large,resin-based substrates used in high-end, decorative architecturalapplications with dye sublimation techniques. In particular,implementations of the present invention can be used to createdye-sublimated panels, even with one or more differentiallydye-sublimated sides/surfaces, albeit without the typically expectedwarping/distortion or edge-rounding to the panel or sublimated images.Implementations of the present invention further provide for thecreation of such dye-sublimated panels using efficient andcost-effective, large-scale manufacturing techniques.

As understood more fully herein, implementations of the presentinvention provide methods capable of imaging decorative architecturallaminate panels of about six feet by about fifteen feet (6′×15′), andmore preferably about five feet by about ten feet (5′×10′), and furtherpreferably about four feet by about eight feet (4′×8′), and aboutone-fourth inch (¼″) to about two inch (2″) gauge or thicker. Inaddition, implementations of the present invention can create suchdecorated panels in a manner that does not create a destructivetemperature gradient across the gauge of the corresponding substrate.For example, implementations of the present invention provide one ormore methods and apparatus that can be used to subject a substrate/dyesublimation assembly to uniform heat and pressure on any and all sides.The term “decorated” as used herein refers to an image, solid color, orcolor gradient, which generally comprises the entire surface area of thesubstrate to which it is applied.

FIGS. 1A-1B illustrate an implementation of a decorative architecturalresin panel 100 prepared in accordance with the principles of thepresent invention. For example, FIG. 1A illustrates that a decorativearchitectural resin panel 100 includes a resin-based substrate having atleast one surface 110 that has been decorated via inventive dyesublimation techniques. FIG. 1B further illustrates an end view of thedecorative architectural resin panel 100 shown in FIG. 1A, showing that,in this example, both sides 110 and 120 have been decorated.

As used herein, the terms “resin-based substrate,” “resin substrate,”“polymer-based substrate,” “polymer substrate,” “resin-based sheet” or“resin sheet” means a substrate comprising materials of one or morelayers or sheets formed from any one of the following thermoplasticpolymers (or alloys thereof). Specifically, such materials include butare not limited to, polyethylene terephthalate (PET), polyethyleneterephthalate with glycol-modification (PETG), acrylonitrilebutadiene-styrene (ABS), polyvinyl chloride (PVC), polyvinyl butyral(PVB), ethylene vinyl acetate (EVA), polycarbonate (PC), styrene,polymethyl methacrylate (PMMA), polyolefins (low and high densitypolyethylene, polypropylene), thermoplastic polyurethane (TPU),cellulose-based polymers (cellulose acetate, cellulose butyrate orcellulose propionate), or the like. Such materials can also includeother thermoplastic polymers or thermoplastic polymer blends that cansufficiently be heated above their glass transition temperature (T_(g)),imparted with a sublimated dye, and then subsequently cooled to solidform. In addition, any given resin substrate or sheet can include one ormore resin-based substrates and any number other layers or coatings.

For example, the decorative architectural resin panel 100 shown in FIGS.1A-1B includes a single resin-based substrate. One will appreciate,however, that the decorative architectural resin panel 100 canalternatively comprise a laminate of multiple resin-based substrates ofthe same or different materials described above. The decorativearchitectural resin panel 100 can also vary in thickness to include arange from relatively thin gauge films to thicker gauge sheets (e.g.,greater than about one-sixteenth inch ( 1/16″) to about 5 inches (5″)).For example, in some implementations, the gauge of the decorativearchitectural resin panel 100 in at least one implementation can beanywhere from about one-sixteenth inch ( 1/16″) to about two inches (2″)inches. The thickness of the decorative architectural resin panel 100can be based at least partially on the number of resin-based substratesit comprises, as well as the desired end-use.

In any event, FIG. 1A shows that resin panel 100 comprises a firstsurface 110 that has been decorated with dye sublimation methods of thepresent invention. Thus, the surface 110 has an aesthetic effectprovided by its color or image. In some implementations, for example,the color of the surface 110 and the finalized decorative architecturalresin panel 100 can be opaque. In other implementations, the color ofthe surface 110 can be transparent or translucent. Indeed, as explainedin further detail below, the color and opacity/translucence of thesurface 110 can be modified in any number of ways to adjust theopacity/transparency of the decorative architectural resin panel 100 fordesired aesthetic effect. For instance, in at least one implementation,a manufacturer can modify the hue, color intensity, and lighttransmission of the dye used in a dye carrier to vary the resultantaesthetic properties of the decorative architectural resin panel 100.

Along these lines, the manufacturer can also vary the amount (i.e.,total area) of the surface 110 to be decorated for similar variations inaesthetic effects. For example, FIG. 1A shows that the decorativearchitectural resin panel 100 has a surface 110 that is entirelydecorated (i.e., the entire surface area is infused with color). Ofcourse, in additional or alternative implementations, the manufacturercan decorate only a portion of the surface 110 to form an image ordecorative design. Similarly, according to some implementations, themanufacturer can sublimate one color onto the majority of surface 110(as shown), and simultaneously sublimate additional colors in the restof the surface, such as to form an image or design. In yet furtherimplementations, the entire surface 110 can be decorated using multiplecolors to form an image or design. Additionally, the manufacturer cansublimate dye into more than one surface of the decorative architecturalresin panel 100. For example, FIG. 1B shows that the decorative panel100 of FIG. 1A also has dye sublimation on the opposing surface 120thereof.

One will appreciate that decorating opposing sides 110, 120 of thedecorative architectural resin panel 100 can provide a great deal ofaesthetic versatility. For example, a manufacturer can print an image onsurface 110 and a complementary image on opposing surface 120.Similarly, a manufacturer can print an image on surface 110 and can alsoprint the same image on surface 120, albeit offset or larger than theimage on surface 110 to create an effect of depth. In one or moreadditional or alternative implementations, a designer or manufacturercan intend surface 120 be the reverse side of a finished product, andcan sublimate a solid color thereon. The manufacturer can then sublimatean image on surface 110 in order to create an effect of depth ordimensionality. Furthermore, in additional implementations, themanufacturer can decorate the surface 110 and the surface 120 to have acolor-to-color or color-to-clear faded image covering substantially theentire surface area of at least one of the upper surface 110 or lowersurface 120. One will appreciate that many different modifications canbe made to obtain varying desired aesthetic effects. In the illustratedimplementation, however, FIGS. 1A and 1B show that a manufacturersublimates dye into the entire surface area of the two opposingsurfaces. For example, FIG. 1B illustrates a first dye or dye layer 130a that has been infused into surface 110 and a second dye or dye layer130 b has been infused into opposing surface 120.

In addition, FIG. 1B shows that, the dye layer 130 a has been infused orsublimated into surface 110 to a first sublimation depth or distance132, and similarly, the dye layer 130 b has been sublimated intoopposing surface 120 to a second sublimation depth or distance 134. FIG.1B also shows that panel 100 comprises a gauge/thickness 136 defined bythe shortest perpendicular distance between opposing surfaces 110 and120, and that the dye layer depths 132, 134 do not span the entire panel100 thickness 136. Thus, one will appreciate that the distances 132, 134to which the dyes 130 a, 130 b are sublimated into the surfaces 110, 120can comprise only a portion of the total thickness or gauge 136 of thedecorative architectural resin panel 100. In most cases, these dyesublimation depths will be only a few microns (i.e., thousandths of aninch).

In at least one implementation, the un-sublimated portion of the gauge136 between the dye layers 130 a, 130 b can comprise the majority of thetotal thickness or gauge 136 of the decorative architectural resin panel100. For example, the combined sublimation depths 132, 134 mightcomprise less than about one-fifth (⅕) of the thickness or gauge 136 ofthe decorative architectural resin panel 100. In such a case, a one-inchthick substrate might have two opposing surfaces that are severalmicrons thick with dye sublimation portions (e.g., 130 a, 130 b), but nomore than one-thirty-second inch ( 1/32″) in either sublimation portion.Thus, the combined sublimation depths 132, 134 of the sublimationportions 130 a, 130 b might be no more than one-sixteenth ( 1/16) of thetotal thickness 136 in combination, leaving fifteen-sixteenths ( 15/16)of the panel 100 thickness 136 “un-sublimated.” For example, FIG. 1Bfurther shows that the thickness 136 includes an un-sublimated portionsuch that the dye layers 130 a, 130 b do not touch or overlap.

One will appreciate, therefore, that a manufacturer can vary the dyesublimation depths 132, 134 particularly with respect to the overallthickness 136 for a variety of effects, such as to vary thetranslucency, hue, and other aesthetic effects for decorativearchitectural resin panel 100. In one implementation, for example, thecombined sublimation depths 132, 134 comprise between approximatelyone-tenth ( 1/10) and one-hundredth ( 1/100) of the total thickness 136of the decorative architectural resin panel 100. In anotherimplementation, the combined sublimation depths 132, 134 comprise atotal distance equal to less than one-hundredth ( 1/100) of the totalthickness 136 of the decorative architectural resin panel 100. One willalso appreciate that the manufacturer can vary the sublimation depths132, 134 in opposing surfaces 110, 120 to also vary the durability ofthe intended aesthetic. For example, the manufacturer may impart deeperdye sublimation depths to ensure that the imparted color is not worn offby wear or touch, at least for an extended period of time.

FIG. 2A illustrates an overview of a sublimation sheet assembly 200 foruse as a precursor in creating a decorative architectural resin panel100, which has one or more dye-sublimated surfaces. Similarly, FIG. 2Billustrates an exploded view of the components of the sublimation sheetassembly 200 in FIG. 2A, albeit rotated by ninety degrees (90°). Inparticular, FIGS. 2A-2B illustrate a sequential overview in accordancewith an implementation of the present invention for positioningcomponents of the sublimation sheet assembly 200 prior to subjecting thecomponents to a dye sublimation process.

For example, FIGS. 2A-2B illustrate that a sublimation sheet assembly200 in accordance with an implementation of the present invention caninclude a resin-based substrate or sheet 230 including opposing top 210and bottom 220 surfaces. At least one of the top 210 and bottom 220surfaces can be configured to be decorated. The resin-based substrate230 can be formed from any of the materials described herein above indefining “resin-based,” and can be translucent or transparent.Additionally, the resin-based substrate 230 can comprise a laminate ofmultiple layers of the same or different compatible materials.

Furthermore, the resin-based substrate 230 can be any appropriatethickness for the resulting thickness of a final decorativearchitectural resin panel 100, such as about two inches (2″), about oneinch (1″), about one-half inch (½″), about one-fourth inch (¼″), aboutone-eighth inch (⅛″), about one-sixteenth inch ( 1/16″), or aboutone-thirty-second inch ( 1/32″) in thickness or gauge as desired. Thesize (i.e., surface area of side 110 or 120) of the resin-basedsubstrate 230 can also be any appropriate size for the resulting size ofthe final decorative architectural resin panel 100. In at least oneimplementation, for example, the resin-based substrate 230 can be aboutfour feet by about eight feet (4′×8′), about four feet by about ten feet(4′×10′), about six feet by about fifteen feet (6′×15′), ortaller/wider. Or alternatively, the resin-based substrate 230 can beabout six inches by about six inches (6″×6″) or shorter/skinnier. Thus,both the gauge and size of the resin-based substrate 230 can be tailoreddepending upon the desired dimensions of a final decorativearchitectural resin panel 100.

FIGS. 2A-2B also depict that the sublimation sheet assembly 200 caninclude one or more dye layers or carriers placed next to, or against,one or more surfaces 210, 220 of the resin-based substrate 230 intendedto be decorated. For example, FIGS. 2A-2B illustrate that whenprocessing a sublimation sheet assembly 200, a manufacturer can place afirst dye carrier 215 a on top of surface 210 of the resin-basedsubstrate 230, and also optionally place a second dye carrier 215 bbelow the bottom surface 220 of the resin-based substrate 230. Each dyecarrier 215 a, 215 b can, in turn, bear an image or solid color producedfrom sublimation dyes. As used herein the term “sublimation dye(s)”refers to any dye capable of sublimation into a resin substrate with theheat and pressures described herein. Specifically, any dye that, uponapplication of heat, sublimates directly from a solid state to a vaporstate. As shown in FIGS. 2A-2B, the dye carriers 215 a, 215 b can eachcover substantially the entire surface 210, 220 of the resin-basedsubstrate 230 against which they are placed. The dye carries 215 a, 215b can cover the entire surface 210, 220 to be decorated to ensure thatthe entire surface area of each surface 210, 220 is infused with dye orcolor.

Optionally, the sublimation sheet assembly 200 can further include oneor more pressure distribution plates. For instance, FIGS. 2A-2Billustrate that a manufacturer can construct the sublimation sheetassembly 200 with two pressure distribution plates 240 a, 240 b.Furthermore, as FIGS. 2A-2B illustrate that the pressure distributionplates 240 a, 240 b can comprise the outermost or extreme layers of thesublimation sheet assembly 200. For example, FIGS. 2A-2B illustrate thata manufacturer can place a first pressure distribution plate 240 a ontop of the first dye carrier 215 a (i.e., adjacent the surface of thedye carrier 215 a opposite the surface placed upon the resin-basedsubstrate 230). Furthermore, the manufacturer can also position a secondpressure distribution plate 240 b below the second dye carrier 215 b. Inat least one implementation of the present invention, the pressuredistribution plates 240 a, 240 b provide a buffer or barrier between thedye carriers 215 a, 215 b and the platens (FIG. 4) of a thermosettingpress, or other apparatus used to impart pressure and heat to thesublimation sheet assembly 200. The pressure distribution plates 240 a,240 b can also aid in distributing temperature, as well as pressure,evenly across the surfaces of the sublimation sheet assembly 200.

In at least one implementation, the pressure distribution plates 240 a,240 b can comprise metal sheets, such as steel or aluminum. Because thepressure distribution plates 240 a, 240 b may be subjected to repeatedstresses from continual direct contact with press platens (FIG. 4), thepressure distribution plates 240 a, 240 b may not be perfectly flat.Accordingly, in some implementations, the sublimation sheet assembly 200can further include a soft, albeit heavy duty, pressure pad (not shown)between each pressure distribution plate 240 a, 240 b and dye carrier215 a, 215 b. The pressure pads can comprise a compressible fabricprepared from copper, silicone, or NOMEX, or a combination of theproceeding. NOMEX is an aramid fabric available from DuPont de Numours,E.I. & Company. One will appreciate that the sublimation sheet assembly200 can also include other layers in addition to the pressure pads thatare not shown in FIGS. 2A-2B. For instance, a manufacturer can includetexture layers and/or additional matting layers as appropriate.

FIGS. 2A-2B further illustrate that a manufacturer can build thesublimation sheet assembly 200 so it is essentially symmetrical about itcenter layer, which in FIGS. 2A-2B is the resin-based substrate 230. Forexample, the manufacturer can place a dye carrier 215 a and then apressure distribution plate 240 a on top of the resin-based substrate230. Then the manufacturer can place the same layers, albeit in reverseorder, below the substrate—a dye carrier 215 b and then a pressuredistribution plate 240 b. Of course, due to the relative thinness of anygiven dye layer 215 a, the sublimation assembly 200 will also beessentially symmetrical using the substrate 230, opposing pressuredistribution plates 240(a-b), but only one dye carrier sheet 215 a.

In any event, and as explained in greater detail below, by ensuring thatthe sublimation sheet assembly 200 is symmetrical about its centerlayer, the manufacturer can ensure heat will transfer evenly anduniformly into the center of the assembly 200 from both sides 210, 220.Specifically, a symmetrical sublimation sheet assembly 200 is at leastone way in which a manufacturer can avoid creating a non-uniformtemperature gradient across the thickness (e.g., 136) of the resin-basedsubstrate 230. As previously mentioned, elimination of an uneventemperature gradient is at least one way that the manufacturer cancreate a dye-sublimated panel without the otherwise attendant warping,bowing, or bending at these sizes (e.g., 5′×10′ or 4′×8′) and gauges(e.g., as much as 1-5″).

In addition, while the sublimation sheet assembly 200 illustrated inFIGS. 2A-2B depicts a single resin-based substrate 230 to be decorated,one will appreciate that the sublimation sheet assembly 200 can includemultiple resin-based substrates to be decorated and thus multiple dyecarriers. For example, FIGS. 3A-3B illustrate another implementation ofa sublimation sheet assembly 200 a that includes three separateresin-based substrates 230. In particular, FIG. 3A illustrates anoverview of a sublimation sheet assembly 200 a for use as a precursor increating multiple decorative resin-based panels 100 that each have oneor more dye-sublimated surfaces. Similarly, FIG. 3B illustrates anexploded view of the components of the sublimation sheet assembly 200 ain FIG. 3A, albeit rotated by ninety degrees (90°).

As shown in FIGS. 3A-3B, a manufacturer can place a dye carrier 215against one or more surfaces of each resin-based substrate 230 to bedecorated. For example, FIGS. 3A-3B illustrate a dye carrier 215 againstboth surfaces of each resin-based substrate 230; however, as previouslymentioned, one will appreciate that a dye carrier can only be placedagainst one surface of one or more of the resin-based substrates 230.Furthermore, a manufacturer can separate any abutting dye carriers 215with separation sheets 250. The separation sheets 250 can ensure thatthe dye from adjacent carriers do not bleed into each other or sublimateinto surfaces of the resin-based substrates 230 that are not intended tobe decorated.

The separation sheets 250 can comprise a glass plate, metal sheet,plastic sheet, paper layer, or other layer that is capable of separatingthe dye carriers 215. Furthermore, just as with the sublimation sheetassembly 200, the extreme layers of the sublimation sheet assembly 200 acan comprise pressure distribution plates 240. Still further, thesublimation sheet assembly 200 a can also include other layers not shownin FIGS. 3A-3B, such as, for instance, pressure pads, texture layers,and/or additional matting layers as appropriate. The illustratedsublimation assembly 200 a of FIGS. 3A-3B, therefore, provides formultiple surfaces of multiple resin-based substrates 230 to be printedby dye sublimation simultaneously. One will appreciate that thesublimation sheet assembly 200 a can increase production capacity andreduce production time and expenses. This increase in productioncapacity is in addition to the increase provided by simultaneouslycoloring or printing on opposing sides of a resin-based substrate 230with dye sublimation techniques in accordance with implementations ofthe present invention.

In addition, FIGS. 3A-3B illustrate that, similar to the sublimationsheet assembly 200, the sublimation sheet assembly 200 a can beessentially symmetrical about its center layer (i.e., the middleresin-based substrate 230). As before, such symmetry is based primarilyon the number and arrangement of pressure plates 240 and/or pressurepads about the given substrate(s) 230, but virtually regardless of thenumber of dye carriers 215 per substrate 230. As mentioned, thisessentially symmetrical arrangement can ensure heat will transfer evenlyand uniformly in from both extreme layers to the center of the assembly.Specifically, the symmetrical sublimation sheet assembly 200 a canprovide dye sublimation to the resin substrates 230, without anywarping, bowing, or bending that a non-uniform temperature gradient maycause.

FIGS. 4-7 and the corresponding text illustrate or describe a number ofdifferent ways in which a manufacturer can provide the appropriate heatand pressure to the sublimation sheet assemblies 200/200 a. For example,FIG. 4 illustrates that a manufacturer can place a sublimation sheetassembly 200/200 a within a first thermosetting environment 400 (e.g., athermosetting press) using an in-feed roller table 410. The firstthermosetting environment 400 can comprise upper and lower platens 412,414. In at least one implementation, the upper and lower platens 412,414 comprise isothermal platens. Additionally, one will appreciatevirtually any size of platens 412, 414 and thermosetting environment 400can be used in order to handle virtually any size or dimension ofsublimation sheet assembly 200/200 a.

In general, the upper and lower platens 412, 414 are configured toprovide direct heat and pressure to both opposing sides of the givensublimation sheet assembly 200/200 a. For example, FIG. 4 shows that themanufacturer has placed the sublimation sheet assembly 200/200 a withinthe first thermosetting environment 400. The manufacturer can then closethe upper and lower platens 412, 414 around the sublimation sheetassembly 200/200 a to apply the appropriate temperatures and pressuresdescribed herein. Specifically, FIG. 4 illustrates that both the upperand lower platens 412, 414 apply pressure P and temperature T1 to thesublimation sheet assembly, and thus, ultimately in two opposingdirections toward the intermediate layers of the sublimation sheetassembly 200/200 a.

As used herein the term “temperature T1” means a temperature sufficientto sublimate the printed dyes into a resin-based substrate. Thus, theterm “temperature T1” means a temperature that is above the dyesublimation temperature of the dye and above the T_(g) of theresin-substrate being decorated. By contrast, as used herein, the term“pressure P” means a pressure sufficient to provide the needed contactforce between a dye carrier and a surface of a substrate to allow thedye to sublimate into the surface, and also to evacuate air between thedye carrier and surface of the substrate being decorated.

In at least one implementation, temperature T1 is between about 350° F.and about 450° F., preferably between about 375° F. and about 425° F.One will appreciate, therefore, that varying resins can have a widerange of glass transition temperatures, and thus, T1 can vary dependingon which resins are used. For example, in an implementation using dyeswith a dye sublimation temperature that is less than the T_(g) of theresin-substrate being decorated, the final temperature T1 of the resinmaterial may vary for materials such as polycarbonate, acrylic, andcopolyesters (e.g., PETG, PET, and PCTG). In other implementations,however, the sublimation temperature of the dye is higher than the glasstransition temperature for materials, and thus a manufacturer willordinarily use the same temperature T1 for each such material. A similareffect can be observed with respect to pressure. For example, in atleast one implementation, the manufacturer can implement a pressure Pthat is between approximately 5 pounds per square inch (psi) andapproximately 250 psi, and preferably between about 5 psi and about 50psi for each such material.

Regardless of the specific temperature chosen for the given material,where applicable, the platens 412, 414 can heat the sublimation sheetassembly 200/200 a to a temperature T1 above the material T_(g) and dyesublimation temperature. According to at least one implementation of thepresent invention, it is important that only the outer surfaces 210, 220of the resin-based substrate 230 are heated sufficiently above theT_(g), and not necessarily the entire gauge or thickness of theresin-based substrate 230. Furthermore, to ensure only the outersurfaces reach the T_(g), a manufacturer can hold the sublimation sheetassembly 200/200 a at temperature T1 for a period of about 30 seconds toabout 5 minutes. More preferably, the manufacturer can hold thesublimation sheet assembly 200/200 a at temperature T1 for betweenapproximately 1 to 2 minutes.

In at least one implementation of the present invention, temperature T1is applied through contact with both upper and lower platens 412, 414uniformly and simultaneously to the sublimation sheet assembly 200/200a. One will appreciate that heating the sublimation sheet assembly200/200 a, and thus the resin-based substrate 230, from both sides (withisothermal platens) can generally eliminate any uneven temperaturegradient across the thickness or gauge of the resin-based substrate 230that might otherwise occur from single-side heating. Thus,simultaneously and uniformly heating both the upper and lower surfaces210, 220 of the resin-based substrate 230 can provide a substantiallyeven temperature distribution through the thickness or gauge of theresin-based substrate 230.

As previously mentioned, this is due at least in part because thesublimation sheet assembly 200/200 a is symmetrical about its centerlayer as explained above. Thus, the rate of heat transfer from theopposing extreme layers to the center of the sublimation sheet assembly200/200 a will be substantially equal. Furthermore, to the extent anytemperature gradient is present, as the resin-based substrate 230 warmsto processing temperature T1, it is expected that the temperature of theopposite surfaces 210, 220 of the resin-based substrate 230 will beuniform across the cross-section of the substrate 230 (both parallel andnormal to the substrate surface). In particular, it is anticipated thatthe entire sublimation sheet assembly 200/200 a can achieve temperaturessufficient to transfer a sublimated image (graphic, solid color, orcolor gradient) during the process.

In addition to heating and holding the sublimation sheet assembly200/200 a at temperature T1, while in the first thermosettingenvironment 400, the platens 412, 414 can apply a pressure P to thesublimation sheet assembly 200/200 a to help ensure uniform sublimationand removal of air between the dye carrier and the substrate. Inparticular, the platens 412, 414 can apply pressure P to ensure propercontact between the one or more dye carriers 215 and the resin-basedsubstrate 230.

Uniformly and simultaneously heating and pressing both opposing sides ofthe sublimation sheet assembly 200/200 a can thus ensure that anyresin-based substrate 230 therein does not warp, bow, and/or bend duringprocessing. This can ensure that each image being sublimated into theone or more surfaces of each resin-based substrate 230 is not offset orotherwise distorted from its intended position. Furthermore, this canensure no corners or edges are deformed and that the entire resin-basedsubstrate 230 can be used as part of a finished decorative architecturalresin panel 100. This is particularly, beneficial considering the costof the material used to produce high-end decorative architectural resinpanels 100.

FIGS. 5A-5C illustrate a sequence of physical changes in a resin-basedsubstrate 230 when it is subjected to pressure P and temperature T1. Forexample, FIG. 5A illustrates an end view of a resin-based substrate 230with dye carriers 215 placed against its opposing upper and lowersurfaces 210, 220. As shown in FIG. 5A, pressure P and temperature T1can be applied simultaneously and uniformly to both the upper and lowersurfaces 210, 220 of the resin-based substrate 230 and the dye carriers215.

FIG. 5B illustrates the changes that the substrate 230 and dye 130 canundergo as the temperature of the resin-based substrate 230 and the dyecarriers 215 reaches T1 (i.e., a temperature above the sublimationtemperature of the dye carriers 215 and the glass transition temperatureof the substrate 230). In particular, FIG. 5B illustrates that once thedye 130 from the dye carriers 215 reaches temperature T1, and theresin-based substrate 230 is above its T_(g), the dye 130 begins tosublimate into the opposing upper and lower surfaces 210, 220 of theresin-based substrate 230. For example, as the dye 130 reaches itssublimation temperature, it changes from a solid to a vapor state andsublimates or infuses into the surfaces 210, 220 of the resin-basedsubstrate 230.

By contrast, FIG. 5C illustrates what occurs once the resin-basedsubstrate 230 and dye carriers 215 have been held at temperature T1 andpressure P for the proper amount of time. Specifically, FIG. 5C showsthat the dye 130 has sublimated into the upper and lower opposingsurfaces 210, 220 to a first and second sublimations depths 132, 134.One will appreciate that the first and second sublimation depths 132,134 can be controlled by the amount of time the dye carriers 215 and theresin-based substrate 230 are held at temperature T1 and pressure P.

According to one implementation of the present invention, once the dye130 has sublimated into the upper and lower surfaces 210, 220 of theresin-based substrate 230 to desired sublimation distances 132, 134, amanufacturer can remove the sublimation sheet assembly 200/200 a fromthe thermosetting environment 400. For example, as shown in FIG. 4, amanufacturer can slide the sublimation sheet assembly 200/200 a across aset of inter-press rollers 416, as indicated by the arrow, into a secondthermosetting environment 420. The second thermosetting environment 420can cool the sublimation sheet assembly 200/200 a to a releasetemperature T2. The second thermosetting environment 420 can uniformlyand simultaneously apply temperature T2 to opposing sides of thesublimation sheet assembly 200 to ensure that a temperature gradient isnot created between the opposing sides of the sublimation sheet assembly200 during cooling.

Thus, in at least one implementation of the present invention, allpressure can be released from the sublimation sheet assembly 200/200 aas it is transferred from a first thermosetting environment 400 to asecond thermosetting environment 420. In other words, according to atleast one implementation of the present invention, the sublimation sheetassembly 200/200 a is not subjected to continuous pressure during theentire dye sublimation process. That is, the pressure of the sublimationsheet assembly 200/200 a is raised to pressure P, released from pressurewhile the assembly is transferred between thermosetting environments,and again raised to pressure P.

Once the sublimation sheet assembly 200/200 a has been placed within thesecond thermosetting environment 420, a manufacturer can close upper andlower platens 422, 424 around the sublimation sheet assembly 200/200 a.In particular, the upper and lower platens 422, 424 can apply a pressureto the sublimation sheet assembly 200/200 a. For example, FIG. 4illustrates that the platens 422, 424 can apply a pressure P to thesublimation sheet assembly 200/200 a. One will appreciate that pressureP applied to the sublimation sheet assembly 200/200 a in the secondthermosetting environment 420 can be equal to, or approximately equalto, the pressure P applied to the sublimation sheet assembly 200/200 ain the first thermosetting environment 400.

Additionally, while in the second thermosetting environment 420, theupper and lower platens 422, 424 can subject the sublimation sheetassembly 200/200 a to a second temperature T2 in order to cool thesublimation sheet assembly 200/200 a to a release temperature. Thus,while in the second thermosetting environment 420, the sublimation sheetassembly 200/200 a can undergo an active cooling phase, which returnsthe resin-based substrate 230 to a rigid state, capturing the dye belowthe surface of the resin-based substrate. Once the sublimation sheetassembly 200/200 a, has been cooled to the temperature T2, amanufacturer can subsequently remove the assembly 200/200 a from thesecond thermosetting environment 420 via a set of out-feed rollers 430.At this point, as shown in FIG. 5C, a manufacturer can remove the dyecarriers 215 (i.e., the sheets previously holding the now-sublimateddye) and other layers of the sublimation sheet assembly 200/200 a fromthe resin-based substrate 230 to form a finished decorativearchitectural resin panel 100.

While the methods described above in relation to FIG. 4 include the useof two thermosetting environments (i.e., a heating press and a coolingpress), in additional implementations of the present invention, a singlethermosetting environment can also be used. For instance, a singlethermosetting environment can uniformly and simultaneously heat opposingsides of the sublimation sheet assembly 200/200 a to temperature T1.Then the same thermosetting environment can cool the sublimation sheetassembly 200/200 a to a temperature T2 by applying a temperature of T2uniformly and simultaneously to the opposing sides of the sublimationsheet assembly 200/200 a. In such implementations, the thermosettingenvironment can subject the sublimation sheet assembly 200/200 a to acontinuous pressure P during the entire sublimation process.

It will be understood that employing a single thermosetting environmentand employing multiple thermosetting environments each providerespective advantages. For example, a single thermosetting environment,which is used to both heat and cool the sublimation sheet assembly200/200 a, requires less workspace than multiple thermosettingenvironments. On the other hand, multiple thermosetting environments candecrease production time and increase production capacity. Specifically,employing separate thermosetting environments to heat and cool thesublimation sheet assembly 200/200 a eliminates the need to wait for asingle machine to both heat up and cool down. Furthermore, when multiplethermosetting environments are utilized, a manufacturer can utilize allunits simultaneously.

One will appreciate that the methods and apparatus described above inrelation to FIGS. 4-5 can thus ensure that the sublimation sheetassembly 200/200 a, and more particularly, the resin-based substrate 230are not damaged during processing. For example, as illustrated in FIG.4, implementations of the present invention can include roller-feeds410, 416, 430 which can be used to transport the sublimation sheetassembly 200/200 a between processing steps. The roller-feeds 410, 416,430 can ensure that the sublimation sheet assembly 200/200 a remainsflat and is not bent or otherwise damaged during transportation. Inaddition, conveyor belts or other similar apparatus can also be used inthe alternative to roller-feeds 410, 416, 430. Furthermore, and aspreviously mentioned, by applying uniform and simultaneous temperatureto the extreme opposing surfaces of the sublimation sheet assembly200/200 a (during both heating and cooling of the resin-based substrates230), a temperature gradient across the gauge of any resin-basedsubstrate 230 of the sublimation sheet assembly 200/200 a can beavoided/effectively eliminated. Avoiding such temperature gradients canensure that the resin-based substrates 230 do not warp, bend, orotherwise deform due to the heat and pressure applied during thesublimation process.

According to additional or alternative implementations of the presentinvention, the dye sublimation process can also be performed with acontinuous process. For example, FIG. 6 illustrates an overviewschematic diagram for coloring a resin-based substrate with a continuousprocess. In particular, FIG. 6 shows that a manufacturer can pre-heat aresin-based substrate 230 c between heating elements 610, 612. It willbe noted that the heating elements 610, 612 can heat opposing upper andlower surfaces 210, 220 of the resin-based substrate 230 c uniformly andsimultaneously to avoid the creation of a non-uniform temperaturegradient across the thickness or gauge of the substrate 230 c. Once theresin-based substrate 230 c has been pre-heated, a dye carrier 215 c canbe applied to at least one of the surfaces 210, 220 of the substrate 230c. For example, FIG. 6 shows that the dye carrier 215 c can be appliedto the resin-based substrate 230 c from at least one set of rolls 614.The at least one set of rolls 614 can maintain dye carrier 215 c at theoperative temperature required for image transfer (i.e., a temperatureabove the dye sublimation temperature).

After the dye carrier 215 c has been applied to at least one surface210, 220 of the resin-based substrate 230 c, dye carrier 215 c and theresin-based substrate 230 c can be pressed at a pressure P between niprollers 616 and 618. The rollers 616 and 618 can also apply atemperature T1 to both opposing surfaces of the resin-based substrate230 c. Once the dye carrier 215 c and the resin-based substrate 230 chave reached temperature T1, the dye from the dye carrier can sublimateinto one or more surfaces 210, 220 of the resin-based substrate 230 c asdescribed above in relation to FIGS. 5A-C.

As discussed above, the applied temperature T1 is a temperature abovethe dye sublimation temperature of the dye, and at or above the T_(g) ofthe resin-substrate (e.g., 230 c) being decorated. Usually temperatureT1 will be between about 350° F. and about 450° F. and more preferablybetween about 375° F. and about 425° F. Additionally, pressure P is apressure sufficient to provide the needed contact force between a dyecarrier and a surface of a substrate to allow the dye to sublimate intothe surface and remove air from the interface surface between the dyecarrier and the substrate. The pressure P can be between approximately 5psi and approximately 250 psi, and preferably between about 5 psi andabout 50 psi.

Once the dye from the dye carrier 215 c has sublimated a desired depthinto the surface(s) 210, 220 of the resin-based substrate 230 c,subsequent rollers (not shown) can actively cool the resin-basedsubstrate 230 c to a release temperature. Or, in the alternative, themanufacturer can position the product so that ambient air can cool theresin-based substrate 230 c. In general, a manufacturer can supplyambient air equally and simultaneously to both surfaces 210, 220 of theresin-based substrate 230 c.

In addition to the foregoing, implementations of the present inventionfurther include methods, mechanisms, and apparatus for creating a dyesublimated product with an autoclave assembly. For example, FIG. 7illustrates an overview schematic diagram for one method of creating adye-sublimated product with an autoclave. As shown in FIG. 7, amanufacturer can place a first distribution plate 710 over the top ofthe sublimation sheet assembly 200/200 a and a second distribution plate712 below the sublimation sheet assembly 200/200 a. The distributionplates 710, 712 can comprise metal sheets. In other implementations, thedistribution plates 710, 712 can comprise glass sheets. Glassdistribution plates 710, 712 may be preferable over metal distributionplates in vacuum/autoclave-based processes because they tend to moreremain flat and rigid over time than metal, and tend to be more scratchand dent resistant than metal, resulting in a smoother, more uniformsubstrate surface. The manufacturer can use the distribution plates 710,712 in addition to, or as an alternative to the pressure distributionplates 420.

After placing the distribution plates 710, 712 about the sublimationsheet assembly 200/200 a, the manufacturer can place the sublimationassembly 200/200 a in a corresponding vacuum bag 720. In particular, themanufacturer can first lay down a vacuum bag 720 on a surface. Themanufacturer then places the sublimation sheet assembly 200/200 atogether with the distribution plates 710, 712 inside of the vacuum bag720, and closes the vacuum bag 720 to form a vacuum bag assembly 725.The manufacturer then seals the edges of the assembly, and attaches avacuum nozzle (not shown) to the vacuum bag 720 to allow for air removalfrom the vacuum bag assembly. The manufacturer then places one or morevacuum bag assemblies 725 within the autoclave 730. The manufacturerthen operates the autoclave 730, which applies equal heat and pressure Pin all directions on the sublimation sheet assembly 200/200 a and anyresin-based substrate 230 included therein.

In one implementation, the pressure P can be between approximately 5 psiand approximately 250 psi. When PETG is used as the material for theresin-based substrate 230, the surface temperature T1, as measured by athermocouple, will generally reach 390-400° F. for dye sublimation tooccur. Similarly, the pressure P is between about 5 psi to about 250psi, and preferably between about 15 psi to about 50 psi.

In general, the autoclave 230 can heat the sublimation sheet assembly200/200 a (e.g., via a convection process, rather than via conduction aswith a mechanical press) with a controlled temperature profile. Inparticular, the manufacturer sets the temperature of the autoclave 730to reach a temperature T1. As discussed above with regards to the otherimplementations, T1 is a temperature (appropriate for the givenmaterials in the sublimation assemblies 200/200 a) above or at therelevant dye sublimation temperature of the dye and about the T_(g) ofthe resin substrate. In one implementation, temperature T1 will bebetween about 350° F. and about 450° F. As shown in FIG. 7, theautoclave 730 can apply temperature T1 uniformly and simultaneously toall six sides of each vacuum bag assembly. Thus, the autoclave 730 canensure that a temperature gradient is avoided in the given vacuum bagassembly 725, and therefore, also any warping or other distortions ofthe panel and/or sublimated image during processing.

Furthermore, the avoidance of a temperature gradient is additionally atleast in part due to the essentially symmetrical nature of thesublimation sheet assembly 200/200 a and the vacuum bag assembly 725. Inparticular, the symmetry (virtually regardless of the number of dyecarrier sheets used, which have nominal thickness) of the vacuum bagassembly 725 can ensure equal rates of heat transfer from each side ofthe assembly 725 in toward its center. The equal heat transfer is alsodue at least in part to the fact that each sublimation sheet assembly200/200 a is held between distribution plates 710, 712 (e.g., ratherthan being placed on a table or surface that can restrict the heattransfer to that side).

Once the vacuum bag assembly 725 has reached pressure P and temperatureT1, any resin-based substrate 230 can undergo the changes describedherein above in relation to FIGS. 5A-5D. In particular, dye cansublimate into each surface of each resin-based substrate 230, next towhich a manufacturer has placed a dye carrier 215. Furthermore, byensuring that no temperature gradient is created through the thicknessof the assembly, a manufacturer can ensure that the dye sublimatesevenly and without distortion into the one or more surfaces of theresin-based substrates 230.

One will appreciate that the autoclaving process can provide a number ofadditional benefits for creating an appropriate, aesthetically pleasing,dye-sublimated decorative architectural resin panel 100. For example,autoclaving is typically not constrained to one size/format (i.e., anautoclave can process a 2′×4′ piece at the same time as an 8′×10′piece). In addition, in the autoclaving process, pressure can becontinuous throughout heating and cooling cycles. This continuouspressure can keep the sublimation sheet assembly 200/200 a flatthroughout the heating and cooling cycles, which can eliminate bowing.Further along these lines, autoclaving is a convective heating processthat allows for more controlled heating and cooling at each directionabout the sublimation assembly, and thus allows for equal temperaturesat the same depth throughout each corresponding substrate's thickness.Again, since the temperature, and pressure, is uniformly distributedthroughout each substrate, the autoclave can process multiple differentsublimation assemblies without any warping/bowing, etc.

In addition to an autoclave process, yet another implementation forheating and pressurizing a sublimation sheet assembly 200/200 a caninclude use of a vacuum press. In particular and as previously mentionedwith respect to the autoclave process, a manufacturer can prepare avacuum bag assembly 725. A manufacturer can then position the vacuum bagassembly 725 into a vacuum press, and apply the same temperatures T1 andpressures P uniformly and simultaneously to opposing sides of the givensublimation assembly 725 to enable dye sublimation without warping. Inanother application of a vacuum press, a dye sublimation assembly thathas not been bagged can be positioned inside a vacuum press chamber,where air is evacuated prior to application of mechanical pressure.

Accordingly, FIGS. 1A-7, and the corresponding text, provide a number ofdifferent components and mechanisms for sublimating surfaces of a panelin an efficient, aesthetically pleasing way. In addition to theforegoing, implementations of the present invention can also bedescribed in terms of flowcharts comprising acts and steps in a methodfor accomplishing a particular result. For example, FIG. 8 illustrates aflowchart of one exemplary method 800 for producing a decorativearchitectural resin panel 100 having a dye sublimated image on opposingsides in accordance with the principles of the present invention. Theacts of FIG. 8 are described below with reference to the components anddiagrams of FIGS. 1A through 7.

For example, FIG. 8 shows that the method 800 of creating a decorativearchitectural resin panel 100 having one or more surfaces including adye sublimated color or image can include a step 810 of positioning aresin-based substrate 230, having opposing surfaces 210, 220. Step 810includes positioning one or more substantially translucent ortransparent resin-based substrates 230 on a surface. For example, amanufacturer positions a first resin-based substrate 230 on a surfacesuch as a manufacturing table.

In addition, FIG. 8 shows that the method 800 can comprise a step 820 ofpositioning at least one dye carrier 215 about the resin-based substrate230. Step 820 includes positioning at least one dye carrier 215 againsta first surface 210 of the resin-based substrate 230. For example, themanufacturer places a dye carrier 215 on top of a first surface 210 ofresin-based substrate 230, such that the dye carrier 215 substantiallycovers the entire surface area of the first surface 210. In oneimplementation, the step 820 can further comprise positioning a seconddye carrier 215 about or adjacent a second surface 220 of theresin-based substrate 230, which opposes the first surface 210.

One will appreciate that the one or more dye carriers 215 can include animage or solid color formed thereon with sublimation dyes. The one ormore dye carriers 215 will thus be positioned against one or moreopposing surfaces 210, 220 of the resin-based substrate 230 and thecombination thereof, along any other layers as described in relation toFIGS. 2A-2B and 3A-3B, will form a sublimation sheet laminate assembly,such as sublimation sheet assembly 200/200 a. Additionally, the step 820can further include creating a sublimation sheet assembly 200/200 a thatis symmetrical about its center layer.

FIG. 8 further shows that the method can comprise a step 830 of applyingheat and pressure uniformly and simultaneously to both the first andsecond surfaces of the substrate, until a dye sublimates into at leastthe first surface of the substrate. In particular, step 830 includesprocessing the sublimation sheet assembly 200/200 a such that the one ormore dye carriers 215 sublimate an image, solid color, or color gradientinto one or more surfaces 210, 220 of the resin-based substrate 230. Forexample, sublimation sheet assembly 200/200 a is subjected to one ormore pressures and temperatures that cause the dye of the dye carriers215 to transition from a solid state directly into a vapor state, andinfuse or sublimate into the one or more surfaces 210, 220 of theresin-based substrate 230 to form a decorative architectural resin panel100. This is done without damaging the resin-based substrate 230, by forexample, warping, bowing, or other deformation.

Although step 830 can comprise any number or order of corresponding actsfor accomplishing the desired result, FIG. 8 shows that step 830comprises at least an act 831 of raising the temperature of thesublimation sheet assembly 200/200 a above the T_(g) of the resin-basedsubstrate 230 and at least the dye sublimation temperature of the dye inone or more of the dye carriers 215. Act 831 comprises placing thesublimation sheet assembly 200/200 a within a first thermosettingenvironment 400, such as a press, and adjusting the temperature of upperand lower platens 412, 414 until the temperature of the sublimationsheet assembly 200/200 a reaches temperature T1. In this case,temperature T1 comprises a temperature above the T_(g) of the materialsof the resin-based substrate 230 and the dye sublimation temperature ofthe dye in the dye carriers 215.

In at least another implementation, act 831 can comprise heating theresin-based substrate 230 between heating elements 610, 612 and thensubjecting the resin-based substrate 230 and the one or more dyecarriers 215 to heat provided by nip rollers 616, 618 until thetemperature of the resin-based substrate 230 and the one or more dyecarriers reaches temperature T1. According to yet another implementationof the present invention, act 831 can comprise placing sublimation sheetassembly 200/200 a within a vacuum bag and then heating the vacuum bagand its contents to temperature T1. In one implementation, the vacuumbag and its contents can be heated within an autoclave. In anotherimplementation, the vacuum bag and its contents can be heated within avacuum press. In another implementation, the sublimation sheet assembly200/200 a can be heated in a vacuum press without a vacuum bag.

One will appreciate, however, whether employing a thermosettingenvironment, heating elements and heated rollers, an autoclave, or avacuum press to heat the sublimation sheet assembly 200/200 a totemperature T1, the heat can be uniformly and simultaneously applied toboth opposing extreme surfaces of the sublimation sheet assembly 200/200a. Thus, the heat can be uniformly and simultaneously applied to bothopposing surfaces 210, 220 of the resin-based substrate 230 via thelayers of the sublimation sheet assembly 200/200 a.

FIG. 8 also shows that step 830 comprises an act 832 of applyingpressure P to the sublimation sheet assembly 200/200 a. In general, thepressure P (as noted throughout this description) is a pressuresufficient to provide the needed contact force between a dye carrier anda surface of a substrate to allow the dye to sublimate into the surfaceand also evacuates air between the dye carrier and surface of thesubstrate. In one implementation, the pressure P can be betweenapproximately 5 psi and approximately 250 psi, and preferably betweenabout 5 psi and about 50 psi. Similar to act 831, act 832 can beperformed in a thermosetting environment, via the use of rollers, in anautoclave, or in a vacuum press, each as described herein above inrelation to FIGS. 3-7. In the implementations in which a vacuum bag isused, act 832 can further comprise the step of evacuating air from thevacuum bag prior to placing it within an autoclave or vacuum press.Additionally, acts 831 and 832 can be performed simultaneously.

In addition, FIG. 8 shows that step 830 can comprise an act 833 ofholding sublimation sheet assembly 200/200 a at the temperature andpressure reached in acts 831 and 832 for period of time. The temperatureand pressure reached in acts 831 and 832 can be held in act 833 until adye sublimates into at least the first surface 210 of the resin-basedsubstrate 230. More specifically, the temperature and pressure can beheld until a dye has sublimated partly into the first surface of theresin-based substrate 230 to a first sublimation depth 232. Inparticular, the temperature T1 and pressure P can be held in act 833 fora period of about 30 seconds to about 5 minutes, and more preferably,between approximately 1 to 2 minutes.

Furthermore, FIG. 8 shows that step 830 can include an act 834 ofdecreasing the temperature of the sublimation sheet assembly 200/200 ato a release temperature. Similar to act 831, act 832 can be performedin a thermosetting environment, with cooled rollers, in an autoclave, ora vacuum press. Furthermore, act 834 can be performed at ambient roomconditions. One will appreciate, however, whether using a thermosettingenvironment, rollers, an autoclave, or a vacuum press to cool thesublimation sheet assembly 200/200 a, the heat used (or lack thereof)can be uniformly and simultaneously applied to both opposing extremesurfaces of the sublimation sheet assembly 200/200 a. Thus, any heat (orlack thereof) can be uniformly and simultaneously applied to bothopposing surfaces 210, 220 of the resin-based substrate 230 via thelayers of the sublimation sheet assembly 200/200 a. More specifically,act 834 can comprise lowering the temperature of the sublimation sheetassembly 200/200 a so that the given sublimation sheet assembly 200/200a undergoes an active cooling phase, to return the resin-based substrate230 to a rigid state, capturing the dye below the surface of theresin-based substrate 230.

Although not shown, a manufacturer can also perform an act of coating(e.g., with 3FORM PATINA 2K specialty coating) any or all surfaces ofthe decorative panel 100 (e.g., after laminating and thermoformingprocesses when the panel is in final product form). In oneimplementation, the spray coating comprises an aliphatic acrylicurethane coating containing silica powder, which provides the laminatepanel with added protection against physical, light-based, and chemicaldamage. Spray-coating also allows the laminate panel surface to be moreeasily re-finished in the event of any marring/damage.

Accordingly, the schematics and methods described herein provide anumber of unique products, as well as ways for creating aestheticallypleasing, decorative, architecturally-suitable resin-based panelsincluding dye sublimated images, color layers, or color gradients. Asdiscussed herein, these resin panels can be substantially translucent ortransparent in order to provide a desired aesthetic. Furthermore, theimplementations of the present invention provide methods of creatingdecorative, architecturally-suitable resin-based panels without damagingthe panels during processing.

In particular, implementations of the present invention can createstructurally useful panels with excellent aesthetic characteristics,which have no bowing, warping, or edge rollover, since they were createdin a manner that avoids non-uniform temperature and pressure gradientsduring the dye sublimation process. As mentioned, this can beaccomplished by providing an essentially symmetric sublimation sheetassembly for dye sublimation that is symmetrical about its center layer,applying heat and pressure uniformly and simultaneously to opposingsurface of the assembly, and ensuring that each surface has equalexposure to any heat source. By ensuring that the panels do not warp,bow, or bend during processing due to a temperature or pressuregradient, implementations of the present invention also ensure that anyimage sublimated into the panel is not stretched, shrunk, offset, orotherwise distorted.

In addition to the foregoing, one will appreciate that panels made inaccordance with the present invention can be formed to a wide variety ofshapes and dimensions. In addition, the structures and processesdescribed herein can be deviated in any number of ways within thecontext of implementations of the present invention. For example, thedye carrier can be combined with a textured paper known in the art ofresin panel manufacture or variation thereof. With such textured paper,the resin-based substrate can receive both dye and texturesimultaneously applying the methods of the present invention.Alternatively, the printed substrate can simultaneously be laminated andtextured with methods known in the art.

The present invention may thus be embodied in other specific formswithout departing from its spirit or essential characteristics. Thedescribed embodiments are to be considered in all respects only asillustrative and not restrictive. The scope of the invention is,therefore, indicated by the appended claims rather than by the foregoingdescription. All changes that come within the meaning and range ofequivalency of the claims are to be embraced within their scope.

1. In a architectural design environment, a method of decorating a resinsubstrate using dye sublimation, comprising: positioning at least onesublimation dye carrier about a resin substrate, having opposing firstand second surfaces; applying equal heat and pressure uniformly andsimultaneously to both the first and second opposing surfaces of thesubstrate, until a dye sublimates into and covers at least the entirefirst surface of the substrate; wherein the resin substrate remainssubstantially flat and uniform at each edge and corner.
 2. The method ofclaim 1, wherein the temperature between the opposing first and secondsurfaces remains uniform throughout the dye sublimation process.
 3. Themethod of claim 1, wherein applying heat and pressure uniformly andsimultaneously comprises raising the temperature of the substrate andthe at least one dye carrier to a first temperature above the glasstransition temperature of the material forming the substrate and thesublimation temperature of the dye.
 4. The method of claim 3, whereinthe first temperature comprises between about 350 degrees Fahrenheit andabout 450 degrees Fahrenheit.
 5. The method of claim 1 wherein applyingheat and pressure uniformly and simultaneously comprises subjecting thesubstrate and the at least one dye carrier to a first pressure ofbetween approximately 5 psi and approximately 50 psi.
 6. The method ofclaim 5, further comprising holding the substrate and the at least onedye carrier at the first temperature and the first pressure for a periodbetween approximately 5 seconds and approximately 5 minutes.
 7. Themethod of claim 1, wherein applying heat and pressure uniformly andsimultaneously comprises pressing and heating the substrate and the atleast one dye carrier in a thermosetting press.
 8. The method of claim7, further comprising releasing the pressure from the substrate and theat least one dye carrier once the dye has sublimated a first sublimationdepth into the first surface and transferring the substrate and dyecarrier from the thermosetting press to a second thermosetting presswherein the substrate and dye carrier are cooled to a releasetemperature.
 9. The method of claim 1, wherein applying heat andpressure uniformly and simultaneously comprises placing the substrateand the at least one dye carrier in a vacuum bag.
 10. The method ofclaim 9, further comprising placing the substrate, the at least one dyecarrier, and the vacuum bag within an autoclave and applying equal heatand pressure in all directions on the substrate at the at least one dyecarrier.
 11. The method of claim 10, further comprising raising thetemperature of the autoclave until the substrate and the at least onedye carrier reach a temperature of between about 350 degrees Fahrenheitand about 450 degrees Fahrenheit.
 12. The method of claim 1, wherein theresin substrate comprises one of polyvinyl chloride, poly (methylmethacrylate), thermoplastic polyester or co-polyester, polyurethane,cellulose-based thermoplastic, or polycarbonate.
 13. A method ofcoloring a decorative resin substrate using dye sublimation, comprising:placing a first sublimation dye layer against a first surface of asubstrate; placing a second sublimation dye layer against an opposingsecond surface of the substrate; applying heat and pressure uniformlyand simultaneously to both the first and second opposing surfaces of thesubstrate, until the first and second dye layers sublimate a depth intoand cover the entire first and second opposing surfaces of thesubstrate; and cooling the first and second opposing surfaces of thesubstrate at the same rate.
 14. The method of claim 13, wherein coolingthe first and second opposing surfaces of the substrate comprisesreducing the temperature of the first and second opposing surface to atemperature below the glass transition temperature of the substratematerial to return the substrate to a rigid state.
 15. The method ofclaim 13, wherein placing the first sublimation dye layer against thefirst surface of a substrate comprises applying a continuous firstsublimation dye layer to a continuous substrate via at least one heatedroller.
 16. The method of claim 13, wherein applying heat and coolingcomprises subjecting the substrate to first a heated roller and second acooled roller.
 17. The method of claim 13, wherein the secondsublimation dye layer comprises a graphic.
 18. The method of claim 13,further comprising: placing a vacuum bag assembly comprising the resinsubstrate and the first and second dye layers into an autoclave;subjecting the assembly within the autoclave to an appropriatetemperature and pressure uniformly and simultaneously in all directionssuch that both dye layers sublimate into the resin substrate.
 19. Themethod of claim 18, further comprising placing at least one sheet of atexturing medium next to the layers of imaged dye carrier.
 20. Themethod of claim 13, wherein the resin substrate comprises one ofpolyvinyl chloride, poly (methyl methacrylate), thermoplastic polyesteror co-polyester, polyurethane, cellulose-based thermoplastic, orpolycarbonate.
 21. A decorative architectural resin panel, comprising: aresin sheet having a thickness defined by a distance that isperpendicular to first and second opposing surfaces; a first sublimateddye that covers the entire first surface, and extends by a firstsublimation depth only partly into the thickness of the resin sheet; anda second sublimated dye that covers the entire second surface, andextends by a second sublimation depth only partly into the thickness ofthe resin sheet; wherein the first and second sublimation depths areseparated by a portion of the thickness of the resin sheet containing nosublimated dye.
 22. The panel as recited in claim 21, wherein thecombined first sublimation depth and the second sublimation depthcomprise less than all of the thickness of the resin sheet.
 23. Thepanel as recited in claim 21, wherein the dye covering the first surfaceform an image and wherein the dye covering the second surface forms acomplementary image.
 24. The panel as recited in claim 23, wherein atleast one of the images covering the first and second surfaces comprisesa solid color covering the entire surface area of the first or secondsurface.
 25. The panel as recited in claim 23, wherein at least one ofthe images covering the first and second surfaces comprises acolor-to-color or color-to-clear faded image covering the entire surfacearea of the first or second surface.
 26. The panel as recited in claim21, wherein the dye provides the decorative architectural resin panelwith an effect of depth.
 27. The panel as recited in claim 21, whereinthe resin sheet comprises one of polyvinyl chloride, poly (methylmethacrylate), thermoplastic polyester or co-polyester, polyurethane,cellulose-based thermoplastic, or polycarbonate.